電路板基礎技術(shù)手札

目錄
概述 1
Overview
電子產(chǎn)品的結(jié)構(gòu) 2
Electronic Products Structure
電路板的發(fā)展史 4
The Development of PCB Industry
電路板的應用 6
Application of PCB
電路板的分類 8
PCB Categories
電路板基礎制程簡介（剛性板篇） 9
Basic PCB Manufacturing Processes Introduction (Rigid Board Section)
典型的剛性多層板制程 10
Typical Rigid Multi-layer PCB Manufacturing Processes
開料 12
Issue Material
抗蝕層涂覆 14
Etching Resist Coating
貼干膜 16
Dry Film Lamination
內(nèi)層圖形轉(zhuǎn)移 18
Inner Image Transfer
形成良好的光致抗蝕劑和圖形側(cè)壁 20
Forming Qualified Photoresist and Pattern Sidewall
顯影、蝕刻、退膜線 22
Developing， Etching， Stripping Line
表面粗化（黑化） 24
Surface Roughening (Black Oxide)
鉚合與預排 26
Riveting and Booking
層壓疊板 28
Lamination Lay-up
熱壓 30
Hot Press
油壓式熱壓機構(gòu) 32
Oil Hydraulic Hot Press Structure
壓板后處理 34
Lamination Post Treatment
機械鉆孔 36
Mechanical Drilling
鉆孔主軸（氣體軸承） 38
Spindle for Drilling (with Gas Bearing)
鉆孔和排屑負荷 40
Drilling Bits and Chip Loading
鉆頭的研磨及取放 42
Drilling Bits Re-Sharp and Setting
釘頭及偏位(鉆孔及電鍍后) 44
Nail Head and Misalignment(After Drilling and Plating)
鍍覆孔制程 46
Plating Through Hole Process
外層貼干膜 48
Dry Film Lamination in Outer Layers
外層曝光 50
Outer Layer Exposuring
圖形電鍍 52
Pattern Plating
外層圖形制作 54
Outer Layer Pattern Creation
阻焊涂覆 56
Solder Resist Coating
金屬表面處理（熱風焊料整平和金手指電鍍） 58
Metal Finish (Hot Air Solder Leveling and Gold Finger Plating)
電路板基礎制程簡介（撓性板篇） 61
Basic PCB Manufacturing Processes Introduction (FPC Section)
撓性板的應用 62
FPC Applications
典型的撓性板制造工藝和生產(chǎn)流程 63
Typical FPC Boards Manufacturing Processes & Production Sequences
撓性板的優(yōu)勢 64
FPC Strengths
撓性板中使用的不同銅箔 66
Different Copper Foils Used in FPC
撓性材料開料 68
Flexible Material Slicing
機械鉆孔 70
Mechanical Drilling
鍍覆孔 72
Plating Through-Hole
貼干膜 74
Dry Film Lamination
曝光 76
Exposuring
顯影 78
Developing
蝕刻 80
Etching
退膜 82
Stripping
假接 84
Pre-lamination
熱壓 86
Hot Press
金屬表面處理 88
Metal Finish
電氣測試 90
Electrical Testing
成形 92
Contouring
檢驗 94
Inspection
組裝 96
Assembly
包裝 98
Packing
電路板的未來發(fā)展趨勢 101
Future Development Trend of PCB
電路板的產(chǎn)業(yè)定位 102
PCB Industry Role
移動設備（便攜式和可穿戴小型化） 103
Mobile Devices (Portable and Wearable Miniaturization)
IC封裝的發(fā)展趨勢 104
IC Package Development Trend
為何需要HDI技術(shù) 105
Why We Need HDI Technology
電路板結(jié)構(gòu)的發(fā)展趨勢 106
PCB Structure Development Trend
典型的線路設計發(fā)展趨勢 107
Typical Pattern Design Development Trend
跨領域的思維 108